PITC is addressing the major challenge of integrated photonics by developing assembly and integration processes that would scale to larger volumes and higher throughputs.
With this programme we are developing full integration process flows for the heterogeneous integration of photonic ICs, and the packaging and assembly into highly scalable multi-chip solutions.
Current challenges
Most integrated photonic applications require a combination of different components, materials and building blocks into one system or sub-system. Heterogeneous photonic circuits with active (III-V) components on passive (SiN or Si-based) chips promise enhanced performance over monolithic platforms, but demand precise die-to-wafer integration. Coupling light into a photonic circuit requires sub-micrometre accuracy, and current integration techniques fail to meet speed or cost requirements. As a result, chip integration and packaging account for a large and rigid part of the total fabrication costs.
Our goal
With our Heterogeneous Integration Programme, PITC contributes to the uptake of integrated photonics by developing full integration process flows that are scalable to very high volumes, at very high speeds, with the purpose of achieving:
Heterogeneous integration of photonic ICs, with components that are developed in our silicon nitride (SiN) and indium phosphide (InP) programmes;
Electronic (driving) chips;
Packaging and assembly into multi-chip modules using an advanced glass interposer.
Our solutions
Panel level integration: glass-based interposers
Panel-level integration is expected to enable cost-efficient photonic chip integration as future PICs grow in functionality and interconnect density. Current PCBs and 3D chip stacking face limitations, where interposers offer a compact, cost-effective solution for multi-chip packaging.
Our advanced glass interposer technology, scalable to large panels with lower RF losses, integrates multiple optical and electrical chips. It utilises through-glass vias (TGVs), high-density electrical RDL, and low-loss optical waveguides. Key innovations include additive high-resolution printing and nano-imprinting.
LIFT4photonics
LIFT4photonics is a laser-based transfer technology for transferring InP coupons onto SiN wafers. In this process, all InP coupons are collectively picked up from an InP wafer and then transferred individually onto a receiving wafer. This method allows for the discrimination between functional and defective dies (i.e., "known good die") and easily accommodates tunable pitch placement. The laser-based approach enables rapid transfer, making the technology ideal for mass production.
New InP-SiN PIC based building blocks
A combination of InP with SiN PICs can outperform the individual chips, as exemplified in external cavity lasers. These integrate InP lasers with SiN filtering circuits but face challenges such as high thermal stabilisation costs and limited optical output power. Our solution involves a multi-gain external cavity laser, enhancing output power, reducing temperature sensitivity, and improving linewidth through precise cavity design.
Contact us
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