PITC offers a comprehensive technology programme centered on indium phosphide (InP) photonic integrated circuits (PICs).
Serving as a bridge between academia and industry, PITC supports partners through pre-competitive applied research to accelerate the transition of IP technology from lab to fab. This is achieved by advancing manufacturing processes, developing intellectual property (IP) building blocks, and enabling seamless integration with other PIC platforms.
Current challenges
The InP chip platform offers unique enabling capabilities and volume scalability for creating advanced lasers, detectors, and modulators for i.e. telecom, datacom and sensing applications. Currently, efficient R&D processes are hindered by a critical gap in the PIC ecosystem. PIC design houses focus on designing application-specific circuits for diverse users, while foundries carry out the chip manufacturing. Available process design kits (PDKs) enable a diversity of circuits. However, new generations of processes and building blocks are key to improve their performance, extend their functionality, and increase the overall maturity of integrated photonic platforms.
Our goal
PITCs InP programme addresses this gap by leveraging deep knowledge of the manufacturing process through close collaboration with equipment developers and foundries. A key challenge lies in fully exploiting the capabilities of the semiconductor technology. This is where PITC excels—we possess both the manufacturing expertise to produce devices and circuits, and the design knowledge necessary to optimise them. By bridging the divide between design and manufacturing, we ensure better integration.
For certain applications, achieving the desired performance requires fine-tuning the technology. To meet these needs, we develop customised building blocks tailored to specific applications. This approach not only enhances performance but also maximises the potential of photonic technologies.
Our solutions
This programme focuses on the following key areas:
Developing manufacturing technologies
PITC plays a crucial role in advancing InP PIC technology towards next-generation manufacturing nodes. This continuous shift is significant because larger wafer sizes offer greater performance and scalability, driven by advancements in processes and equipment. PITC is instrumental in facilitating this transition by collaborating with foundries and equipment suppliers to address risks, reduce costs, and ensure high performance and reliability. By proactively supporting this evolution, PITC continues to enhance the capabilities of InP technology and maintain its competitiveness in an expanding market.
Creating custom InP building blocks
PITC currently focuses on advancing fields like LiFi, LiDAR, and communication applications, which often demand performance of optical amplifiers, lasers and modulators beyond standard building blocks. To drive these advancements, PITC develops customised intellectual property (IP) building blocks compatible with foundry processes. This approach, similar to tailored designs in electronics, addresses specific application needs. Building on its expertise in InP PICs, PITC continuously optimises processes to enhance performance, reproducibility, and reliability of PICs. By innovating at both the device and circuit levels, PITC delivers groundbreaking performance while meeting the unique requirements of its partners.
Developing advanced integration solutions
Integration plays a crucial role in advancing photonic technologies. While some applications can rely on a monolithic approach, many require combining multiple complementary platforms. Through cooperating with its Heterogeneous Integration programme, PITC is leading efforts to integrate InP with silicon-based platforms. A key method under development is the Laser-Induced Forward Transfer (LIFT) technique, which places InP coupons onto silicon substrates, requiring customised InP designs for successful integration.
Creating synergy through programme interactions
PITC fosters collaboration through a shared open innovation model, promoting cross-programme interactions to maximise the impact of photonic technologies. By working with other programmes, the InP programme carries out R&D with a clear focus on PIC technology manufacturability. This approach leverages the strengths of various research initiatives, driving innovation and supporting application development for its partners.
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