Test processes are among some of the biggest challenges in scaling up integrated photonics, contributing to as much as 30 percent of total production costs.
With its unique Metrology Programme, PITC focuses on advancing and optimising test processes and defining standards for large-scale manufacturing of PICs at reduced costs.Next to integration and packaging, test assembly and packaging is the biggest challenge in scaling up integrated photonics, contributing to as much as 30 per cent of total production costs. With its unique Metrology Programme, PITC focuses on advancing and optimising testing processes and standards for large-scale manufacturing of PICs at reduced costs.
Current challenges
IIntegrated photonics offers sustainable societal benefits, but adoption is hindered by lengthy development cycles and limited production throughput.
Testing and validation are crucial in developing photonic integrated circuits (PICs), with testing accounting for 30% of production costs. Identifying known-good-die (KDG) and improving performance yield is essential for creating accurate models for next-generation products. However, testing high-speed optical signals with dense IO interfaces is challenging, as photonics lags behind microelectronics in IO capability and suffers from underinvestment.
Early testing is vital but costly due to specialised systems needed for diverse interfaces. Collaboration among photonic, microelectronic, and mechanical experts highlights the need for standardisation to simplify data exchange and validation. Prioritizing efficient testing processes ensures cost-effective, high-performing PICs.
Our goal
PITC addresses these challenges through its Metrology Programme, focusing on design-for-test methodologies, characterisation, and automation of test tools for next-generation photonics. By reducing development time and improving test throughput, PITC accelerates market adoption and scaling of integrated photonics. In a collaborative research environment, PITC partners with industry to tackle these critical issues.
Open standards test framework
Testing is a nascent field in Integrated Photonics lacking standardised solutions. Within the programme, we support open standards for the interoperability and exchange of data. This is not only to enhance understanding at various points in the production flow but also to extend it to the very beginning of the process — the design phase, at a wafer level.
Increased scalability of testing
The number of tests and time-to-test required to stabilise a process and increase throughput are relatively high and long respectively. Therefore, testing processes must improve in accuracy, reliability, throughput, and speed. The cost-efficiency is also of the essence. Consequently, there is an urgent need to improve the scalability of the currently available test solutions, to facilitate an efficient process from the prototyping, through the pilot phase, production in small batches and ultimately large volumes.
Developing Automated Test Equipment
Electronic-photonic testing at scale for high volume manufacturing (HVM) focuses on Wafer Level Test (WLT) and inspection up to 300mm. The Metrology Programme is focused on developing Automated Test Equipment (ATE) for photonics, using next generation rapid methods that increase testing speed from minutes to seconds. Standardisation of data flows, design and interfaces will help increase interoperability between tool suppliers and fabs. By applying machine learning we are able to optimise testing processes, contributing to the quality and reliability of integrated photonics.
Tenfold throughput increase
The programme focuses on developing design-for-test methodologies, product characterization, and test automation tools to shorten product development cycles by three months, enabling ‘first-time-right’ designs and avoiding costly iterations. Advanced testing tools significantly boost throughput, reducing testing time from minutes to seconds per device. Massively parallel testing methods, including wafer-level tests, automated equipment, and predictive data analysis, optimise production flow and maximise throughput.
Creating synergy through programme interactions
PITC fosters collaboration through an open innovation model, encouraging cross-programme interactions to amplify the impact of photonic technologies. The InP and SiN Technology Programmes leverage testing expertise from the Metrology Programme and packaging knowledge from the Heterogeneous Integration Programme. This synergistic approach drives innovation and supports application development for our partners.
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